Relay and Matrix Boards
TEDLinx Relay and Matrix Modules provide high-density, reliable, and intelligent switching solutions for your most demanding automated test and measurement applications. Designed on the versatile 3U Eurocard form factor, these modules integrate seamlessly into custom test platforms and communicate via a robust RS485 Daisy Chain Interface, allowing for scalable and distributed system architectures.
High-Density Relay & Matrix Switching Modules
Precision Switching Solutions for Automated Test Equipment (ATE)
TEDLinx Relay and Matrix Modules deliver high-density, reliable switching for automated test systems, featuring 3U Eurocard design and RS485 Daisy Chain scalability.Engineered for precision and durability, they ensure seamless integration and intelligent control in complex test environments.
Core Product Features (TL-SWITCH-31 & TL-MUX-31)
Our switching modules are built using industrial-grade components to ensure reliability and longevity in challenging environments.
Key Features:
Specification | TL-SWITCH-31 (Relay Switch) | TL-MUX-31 (Relay MUX/Matrix) |
Relay Configuration | 64 × SPDT (1 Form C) | 64 × DPDT (2 Form C) |
Form Factor | 3U Eurocard (100 × 160 mm) | 3U Eurocard (100 × 160 mm) |
Max Contact Ratings | Max 2 A @ 30 VDC / 0.6 A @ 125 VAC | Max 2 A @ 30 VDC / 0.6 A @ 125 VAC |
Coil Voltage | +12 V DC ±10% | +12 V DC ±10% |
Interface | Daisy Chain RS485 Interface | Daisy Chain RS485 Interface |
Protection | Polyfuse on coil supply, clamp diodes in ULN drivers | Polyfuse on coil supply, clamp diodes in ULN drivers |
Onboard Control | ARM Cortex-M3 core | ARM Cortex-M3 core |
Real-World Applications
Our modules are designed to be the backbone of diverse automated test systems, enabling complex signal routing and high-throughput testing:
- Automotive ECU/Harness Testing: Using the TL-MUX-31 DPDT module to handle isolated high/low-side signals for simulating sensors and switching power to various points in an Electronic Control Unit (ECU) test setup.
- Production Line Continuity Testing: Utilizing the high density of the TL-SWITCH-31 SPDT module to rapidly check for open/short circuits across hundreds of test points on printed circuit boards (PCBs) or large cable harnesses.
- Functional Test (FCT): Creating versatile matrix topologies by ganging multiple TL-MUX-31 cards, allowing any test instrument (DMM, Scope, Power Supply) to connect to any pin on the Device Under Test (DUT).
- Data Acquisition Scanning: Configuring the modules as multiplexers to sequentially connect many low-frequency sensors (like thermocouples or thermistors) to a single high-accuracy measurement instrument.
Intelligent Communication and Control
Both modules utilize a robust, packet-based communication protocol over an RS485 bus, ensuring reliable control and minimal latency even in large daisy-chained systems. Both the TL-SWITCH-31 and TL-MUX-31 modules incorporate an onboard microcontroller for intelligent, distributed control, maximizing system reliability and simplifying host communication.
Onboard Controller Details
- Microcontroller: 32-bit ARM Cortex-M3 RISC core (STMicroelectronics) .
- Performance: Operates at 72 MHz with a performance of 1.25 DMIPS/MHz .
- Memory: 64 KB Flash and 20 KB SRAM .
- Role: The controller manages the Daisy Chain RS485 Interface communication, handles the command parsing, and directly controls the relays based on the unique Board ID set by DIP Switches
Daisy Chain RS485 Interface
The RS485 interface allows for highly scalable test systems by enabling a single host communication port to control up to 255 switching cards .
- Protocol: Command and status communication is handled via a structured packet protocol that includes a Board ID, a COMMAND byte, and a CRC16 checksum for error-free transmission .
- Packet Structure: Each packet is defined by a HEADER (0xAA) and a FOOTER (0x55) byte, ensuring packet integrity and synchronization .
Relay and Matrix Boards – High-Density Intelligent Switching Solutions
TEDLinx Relay and Matrix Modules provide high-density, reliable switching solutions for automated test systems. With RS485 Daisy Chain connectivity and onboard ARM Cortex-M3 control, they deliver precise, scalable performance and seamless integration.
Communication Packet Structures
- Communication follows a fixed-length packet structure for both command and response messages.
- Each packet includes specific HEADER and FOOTER bytes to maintain synchronization.
- This design ensures consistent, reliable, and error-free data exchange between modules.
TL-SWITCH-31 Packet (Relay Switching Card)
The switch card uses the DATA field (up to 12 bytes) to control the state of multiple relays in a single command.
Field | Size(Bytes) | Example Value | Description |
HEADER | 1 | 0xAA | Start of packet |
SIZE | 1 | variable | Packet length |
ID | 1 | 0x01 – 0xFF | Board ID |
COMMAND | 1 | 0x01–0x03 or 0x11–0x33 | Command / Response |
DATA | 12 | up to 12 bytes | Relay or status data |
CRC | 2 | 2 bytes | CRC16 checksum |
FOOTER | 1 | 0x55 | End of packet |
TL-MUX-31 Packet (Matrix Card)
The matrix card uses the RELAY ID field (2 bytes) to specify the particular relay pair or node to be switched for destination connection.
Field | Size(Bytes) | Example Value | Description |
HEADER | 1 | 0xAA | Start of packet |
SIZE | 1 | variable | Packet length |
ID | 1 | 0x01 – 0xFF | Board ID |
COMMAND | 1 | 0x01–0x03 or 0x11–0x33 | Command / Response |
RELAY ID | 2 | 2 Bytes | Relay ID to switch for Destination |
CRC | 2 | 2 bytes | CRC16 checksum |
FOOTER | 1 | 0x55 | End of packet |
Key Benefits of TEDLinx Modules
Our modules are engineered to provide maximum value and performance in your automated test environment:
- Scalable Architecture: The RS485 Daisy Chain Interface allows you to easily connect and control numerous switching cards from a single host port, making system expansion straightforward and cost-effective.
- High Reliability & Protection: Built-in safeguards, including Polyfuses on the coil supply and clamp diodes in the driver circuits, ensure module longevity and protection against transient electrical events.
- Intelligent Onboard Control: The dedicated ARM Cortex-M3 controller handles real-time communication and relay driving, offloading processing overhead from the main test controller and enabling quick, deterministic switching.
- Versatile Configurations: The availability of both high-density SPDT (TL-SWITCH-31) and versatile DPDT (TL-MUX-31) modules ensures you have the right topology for general switching, multiplexing, and complex matrix routing.
- Standardized Form Factor: The industry-standard 3U Eurocard size simplifies integration into existing chassis and enclosures, accelerating your time-to-market for new test systems.
